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JPY3,252
RRP: JPY3,520
You save JPY268

Bandai Candy Mobile Suit Gundam SEED Memorial Anime Card Collection + Wafer (FULL BOX)

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JPY3,252
RRP: JPY3,520
You save JPY268

Expected release date is Dec 31, 2026

Info

SKU:BDC93295 ,UPC: ,Shipping:

Info

SKU:
BDC93295
UPC:
4570117932953
Shipping:
Calculated at Checkout

Description

29 collectible items in total

One metallic plastic card (29 types total, including 1 secret)

Premium collectible wafer snack featuring artwork from the Mobile Suit Gundam SEED series
Includes iconic scenes and mobile suits from the series, plus newly drawn original illustrations

Each pack contains one metallic plastic card and one vanilla cream flavored wafer

Frequently Bought Together:

Bandai Candy Mobile Suit Gundam SEED Memorial Anime Card Collection + Wafer (FULL BOX)
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