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JPY2,846
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Bandai Candy Niformation Mobile Suit Gundam Sticker Wafers Vol.7 1Box 20pcs (FULL BOX)

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JPY2,846
RRP: JPY3,080
You save JPY234
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Expected release date is Feb 28, 2027

Info

SKU:BDC93464 ,UPC: ,Shipping:

Info

SKU:
BDC93464
UPC:
4570117934643
Shipping:
Calculated at Checkout

Specifications

Series,

Specifications

Series:
Mobile Suit Gundam

Description

Niformation Mobile Suit Gundam Sticker Wafers Vol.7 1Box 20pcs (FULL BOX).

  • Sale Format: One full box containing 20 packs
  • Lineup: 38 stickers including 3 secrets
  • Contents Per Pack: One sticker and cocoa cream wafer

Blind assortment; a complete set is not guaranteed.

  • JAN: 4570117934643

Frequently Bought Together:

Bandai Candy Niformation Mobile Suit Gundam Sticker Wafers Vol.7 1Box 20pcs (FULL BOX)
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